| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting method for a non-contact type IC chip which is neither rubbed off nor peeled off even when a some external force is applied and a package material with the IC chip manufactured mounted thereon by using this mounting method. SOLUTION: By the mounting method for the IC chip where data can be read out or read in in a non-contact method, the non-contact type IC chip (12) is pressed in a base material sheet (11) by applying physical pressure (13) from above the non-contact type IC chip (12) mounted on the base material sheet (11). |
