| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the manufacturing method, of multilayer interconnection boards, that is advantageous for mass production, since a gap for forming an insulating layer is controlled easily, can thin the entire board, and is also advantageous to the planarization of a board surface; and to provide the multiplayer interconnection boards obtained by the manufacturing method. SOLUTION: The manufacturing method of multiplayer interconnection boards includes a process of heating and pressurizing a laminate for integration, while a plurality of double-sided wiring boards 10, where a wiring pattern 12 is formed on both the surface of an insulating layer 11 are being laminated via a prepreg 1 where a thermosetting resin, is immersed to a resin porous film.</p> |
