| 摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus and a vacuum treatment method for preventing organic contamination from occurring to a body to be treated easily, even if organic matters are present in a vacuum portion. SOLUTION: A vacuum treatment apparatus 100 for performing specific treatment on a body to be treated under a vacuum has a wafer conveyance chamber 5 for retaining a wafer W, which is the body to be treated in a vacuum, an evacuating mechanism 42 for enabling the wafer conveyance chamber 5 to be subjected to evacuation, a purge gas supply mechanism 44 for supplying a purge gas into the wafer conveyance chamber 5, and a needle valve 45 for control pressure in the wafer conveyance chamber 5. In this case, exhaust due to the exhausting mechanism 42 and purge gas supply due to the purge gas supply mechanism 44 are carried out to the wafer conveyance chamber 5, and at the same time, the pressure in the waver conveyance chamber 5 is controlled by the needle valve 45. |
