SHEET WITH NON-CONTACT TYPE IC CHIP AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a sheet with a non-contact type IC chip, which is used while being fitted to a product or a package body or used as a raw material of a package body and facilitates the management of materials in the middle of stock control and manufacture, and its manufacturing method. SOLUTION: The non-contact type IC chip (12) has an adhesive layer (13) on a sheet type material (11) and data can be read out of or read out of and written to the adhesive layer on a contactless system. A peeling sheet (14) may be laminated on the adhesive layer (13) and further a sheet material (15) may be laminated on the adhesive layer (13).