| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a coating film on a substrate, by which a uniform coating film can be formed on a substate such as a silicon wafer. SOLUTION: By this method for forming the coating film 30 on the top surface of the substrate 10, a pre-coating area L is provided at the outer circumference of the substrate 10 and when a liquid coating agent 30 is applied, the agent 30 is applied to entire surface of the substrate 10 from the end part to the pre-coating area L. Consequently, a swelling crown part 50a of the liquid coating agent 30 is formed outside the substrate 10, so the uniform coating film 50 is formed on the substrate 10. |
