| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an acoustic wave element in which an internal stress of a thin film is reduced without a side effect of increasing a loss of BAW(bulk acoustic wave). SOLUTION: A piezoelectric thin film 104 is splitted into a plurality of regions to relax the internal stress. An air bridge 106 can easily be formed by using a thin film sacrifice layer 601 as a method of easily realizing the split structure. Further, the length of the air bridge 106 is decreased resulting in decreasing parasitic resistance and parasitic inductance. |
