| 摘要 |
<p>PROBLEM TO BE SOLVED: To fully cope with the shift to a larger and thinner plate of a substrate, finer and more precise process, and less dust in process, and positioning at high-speed and reliably. SOLUTION: A position and an inclination of a substrate 4 which are supported by a supporting means 20 from bottom thereof are imaged by cameras 10 at angles R and S, which are opposite with each other, for image recognition, and when a deviation in position or an inclination is recognized, the substrate 4 is positioned to a predetermined location by moving the supporting means 20 in the direction of X or Y axis, or around Z axis. At this time, intersections of an extension of a line connecting two points on one of the two sides in the substrate forming angles of the substrate 4 and an extension of a line connecting two points on other side are recognized as angles R and S, and image recognition is performed, based on which the substrate is positioned, thus above purpose is achieved.</p> |
