| 摘要 |
PROBLEM TO BE SOLVED: To prevent use of harmful substances in solder for coating and generation of short-circuiting of electrodes even when the solder coating is performed to one surface or both surfaces of a first substrate and a second substrate in a thermo-module wherein each semiconductor element is sandwiched by a plurality of electrodes provided on a first substrate and a plurality of electrodes (not illustrated) provided to a second substrate to alternately and electrically connect in series a P-type semiconductor element and an N-type semiconductor element. SOLUTION: This thermo-module 40 is configured to alternately allocate the P-type semiconductor element 31 and N-type semiconductor element 32 via the electrodes 11, 21 by holding, like sandwiching, a plurality of P-type semiconductor element 31 and N-type semiconductor element 32 between the electrode 11 formed on the first substrate 10 and the electrode 21 formed on the second substrate 20. The electrodes 11, 21, P-type semiconductor element 31 and N-type semiconductor element 32 are coupled with the solder paste which is mainly composed of An-Sn.
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