| 摘要 |
PROBLEM TO BE SOLVED: To provide a device which can effectively radiate heat to prevent situations, when a printed board mounted with a semiconductor device is stored in a shield case, the shield case is filled with heat generated from the mounted semiconductor device, resulting in deterioration of the performance of circuit elements which constitute a circuit module. SOLUTION: In a heat radiating device, a circuit pattern and a first ground pattern are formed on a first surface of the printed board, and a second ground pattern is formed on a second surface. The first and the second ground patterns are connected to each other via a through-hole conductor. The semiconductor device is mounted on the first surface of the printed board, with a terminal of the semiconductor device being connected to the circuit pattern and the bottom face of the semiconductor device in contact with the first ground pattern. The printed board, mounted with the semiconductor device, is covered with a shield case, and a part of the shield case is cut up to form an elastic contact piece, so as to be brought into contact with the second ground pattern.
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