| 摘要 |
PROBLEM TO BE SOLVED: To improve output efficiency of a flip-chip semiconductor light emit ting element and form uniform optical distribution over the entire part of light emitting surface. SOLUTION: This flip-chip semiconductor light emitting element comprises a light transmissive substrate (1), a first semiconductor layer (2) of a first conductivity layer on the substrate (1), a second semiconductor layer (3) of a second conductivity which is different from the first conductivity layer on the first semiconductor layer (2), a first electrode (4) electrically connected to the first semiconductor layer (2) and a second electrode (5) electrically connected to the second semiconductor layer (3). Since a first connecting layer (6) provided on the first electrode (4) is connected to the first semiconductor layer (2) and is formed surrounding the second electrode (5), the current flows passing almost the entire peripheral part of the second electrode (5). |
