发明名称 METHOD FOR MANUFACTURING ELECTROMAGNETIC WAVE ABSORBING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a method for manufacturing an electromagnetic wave absorbing board, capable of imparting an electromagnetic wave antireflection function to a slope surface or a vertical wall surface and growing a plant. SOLUTION: The method for manufacturing the electromagnetic wave absorbing board 10 comprises the steps of forming a plurality of granular intermediate particles, in which a core material is covered with a coating solution, in which an electromagnetic wave absorbing heating material is dispersedly mixed with the solution to be mixed, and solidifying the solution to be mixed of each intermediate particle, in a state in which a plurality of the particles are made to contact, and thereby molding the solution in a plate-like state in which air gaps 12 are formed. Here, the absorbing board 10 is installed on the normal or the wall surface. Thus, the electromagnetic wave absorbing heating material in the board 10 absorbs electromagnetic waves, and the antireflection function can be imparted to the normal or the wall surface. Furthermore, since a polymer 28 is filled in air gaps 12 of the board 10 and the heating material absorbs the wave and heats, a moisture can be stably supplied to the plant on the board 10, the heating material can heat and growing of the plant can be promoted.
申请公布号 JP2003017887(A) 申请公布日期 2003.01.17
申请号 JP20010199948 申请日期 2001.06.29
申请人 TAKENAKA KOMUTEN CO LTD;TAKENAKA DOBOKU CO LTD;TAKENAKA DORO:KK 发明人 SAKUMA MAMORU;HARAKAWA KENICHI;FUJII YOSHIBUMI;KUNISHIMA TAKESHI
分类号 E04B1/92;H01F1/00;H05K9/00 主分类号 E04B1/92
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