发明名称 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide an insulation film of a low dielectric constant and high mechanical strength. SOLUTION: This semiconductor device is provided with the insulation film, provided with a porus structure formed on the surface of a substrate and consisting of the holes of three-dimensional network structure.</p>
申请公布号 JP2003017483(A) 申请公布日期 2003.01.17
申请号 JP20010198943 申请日期 2001.06.29
申请人 ROHM CO LTD 发明人 NISHIYAMA NORIKAZU;KAMIYAMA KOREICHI;OKU YOSHIAKI
分类号 H01L21/768;H01L21/316;H01L21/8246;H01L23/522;H01L27/105;(IPC1-7):H01L21/316 主分类号 H01L21/768
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