| 摘要 |
<p>PROBLEM TO BE SOLVED: To perform transfer, with the semiconductor chips turned upside down, without employing an UV light sensitive adhesive sheet, thereby improving transfer yield of semiconductor chips. SOLUTION: A second adhesive sheet 1 is stuck to one side of a plurality of semiconductor devices 7 other side of which is stuck to a first adhesive sheet 5, a pressure plate 4 is placed on the reverse side of adhesive face of the first adhesive sheet 5, the first adhesive sheet 5 is rolled up along an edge of the pressure plate 4, the rolled portion is pulled backward of the pressure plate 4 while the semiconductor device 7 is pressed to the second adhesive tape 2 by the pressure plate 4, moves the pressure plate backward while sliding relatively with the pressure plate 4, and the semiconductor devices 7 are torn off from the first adhesive sheet 5 to transfer the semiconductor devices 7 to the second adhesive sheet 2.</p> |
