| 摘要 |
PROBLEM TO BE SOLVED: To improve a resistor layer in thickness accuracy, and to provide a thick film resistor unit which can be improved in manufacturing efficiency. SOLUTION: A resistor layer 12 is printed on a board 11, and conductor layers 13a and 13b are printed on the top surface of the resistor layer 12. Thereafter, the resistor layer 12 and the conductor layers 13a and 13b are baked at the same time.
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