| 摘要 |
PROBLEM TO BE SOLVED: To surely produce a semiconductor chip of high quality, having no cutout or the like in the so-called 'pre-dicing technique' for dividing into individual semiconductor chips by making a cut groove manifested by grinding the rear surface. SOLUTION: A dividing system 1 for a semiconductor wafer comprises at least a grounding controller 6 for controlling grounding feed amount at a rough grinding unit 4 and a finish grinding unit 5. The dividing system 1 further comprises a wafer thickness by an actual measuring means 7 for actually measuring the thickness of the wafer, and a groove bottom thickness actually measuring means 8 for actually measuring a thickness of a cutting groove to a bottom. A method for dividing comprises the steps of obtaining a depth of the cut groove at the controller 6 based on the actually measured values of the means 7 and the means 8, regulating a grounding feeding amount at the unit 4 and the unit 5 based on the value of the depth of the groove, not expressing the cut groove at the rough grinding, and expressing the cut groove surely at the finish grinding to divide into the individual semiconductor chips. |
