| 摘要 |
PROBLEM TO BE SOLVED: To provide a dry etching apparatus having high flexibility of design. SOLUTION: A package 200, having an SAW element chip, is installed in a sub chamber 40 comprising a detachable lid 50 and a wiring board 30 being mounted on the outer wall of a main chamber 10, thus conveying the package 200 to the sub chamber 40 in the atmosphere, and hence increasing the flexibility of the design of a conveyance mechanism and of the entire apparatus.
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