| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board, which has a laminated structure that is simple, manufactured through a simple manufacturing process, equipped with a capacitor which can be reduced in size, and capable of improving a wiring unit in high-frequency characteristics and noise resistance properties. SOLUTION: A wiring board is equipped with a laminated structure provided with a capacitor-forming unit 21, where at least either of conductor layers 20 and 30 formed on both the sides of an insulation layer 10 forms the electrode of a capacitor and a wiring unit 22, which wires a circuit. The insulation layer 10 is formed of a composite porous film 11, and an insulation layer 10a, interposed in the capacitor-forming unit 21, is made to have a higher dielectric constant than an insulating layer 10b interposed in the wiring unit 22, depending on whether or not the porous film 11 filled up with a filler or by the kind of the filler filling the porous film 11.</p> |
