| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that, when a semiconductor device is constituted of a semiconductor chip size, it is feared of a damage of an element in the case of rewiring on an element region of the chip. SOLUTION: The semiconductor device comprises a conductor wiring layer 12 having grooves 10 arriving at electrode pads 8 on a front surface at a rear surface of the semiconductor chip 9 and forming a conductor wiring layer 12 electrically connected via the grooves 10, and a wiring pattern having no influence to an element region of the chip 9 provided on the rear surface side by rewiring on the chip rear surface side. Thus, in the case of mounting the semiconductor device on a mounting substrate, it is not feared to damage the element region.</p> |
