WAFER BONDING TECHNIQUES TO MINIMIZE BUILT-IN STRESS OF SILICON MICROSTRUCTURES AND MICRO-MIRRORS

摘要

A bonded wafer fabrication mechanism for a micro-mirror structure provides for oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.