发明名称 |
Systems and methods for simultaneous or sequential multi-perspective specimen defect inspection |
摘要 |
Systems and methods for inspecting a surface of a specimen such as a semiconductor wafer are provided. A system may include an illumination system configured to direct a first beam of light to a surface of the specimen at an oblique angle of incidence and to direct a second beam of light to a surface of the specimen at a substantially normal angle. The system may also include a collection system configured to collect at least a portion of the first and second beams of light returned from the surface of the specimen. In addition, the system may include a detection system. The detection system may be configured to process the collected portions of the first and second beams of light. In this manner, a presence of defects on the specimen may be detected from the collected portions of the first and second beams of light.
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申请公布号 |
US2003011760(A1) |
申请公布日期 |
2003.01.16 |
申请号 |
US20020192813 |
申请日期 |
2002.07.10 |
申请人 |
VAEZ-IRAVANI MEHDI;STOKOWSKI STAN;BIELLAK STEPHEN;SULLIVAN JAMIE;WELLS KEITH;NIKOONAHAD MEHRDAD |
发明人 |
VAEZ-IRAVANI MEHDI;STOKOWSKI STAN;BIELLAK STEPHEN;SULLIVAN JAMIE;WELLS KEITH;NIKOONAHAD MEHRDAD |
分类号 |
G01N21/84;G01N21/47;G01N21/94;G01N21/95;G01N21/956;H01L21/027;H01L21/66;(IPC1-7):G01N21/88 |
主分类号 |
G01N21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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