Method for fabricating surface acoustic wave filter package

摘要

Disclosed is a method for fabricating a surface acoustic wave filter chip package comprising the steps of mounting the surface acoustic wave filter chip on a substrate; forming a underfill in a space between the substrate and the surface acoustic wave filter chip; forming a metal shield layer on an whole outer wall of the surface acoustic wave filter chip by using a spray process; and molding resins on the metal shield layer. The method has advantages in that a fillet forming step for improving a step-coverage is removed by forming a metal shield layer from a conductive epoxy with the use of a spray nozzle, a one-ply metal shield layer is formed without an additional metal layer for preventing oxidation of the metal layer by forming an exterior of the SAW filter chip package with the use of a top molding process, and that a structurally stable SAW filter package can be fabricated.