| 发明名称 |
Multilayer printed board |
| 摘要 |
Disclosed is a multilayer printed board to be provided with electronic components, which has at least one layer whose thermal expansion behavior corresponds approximately to the thermal expansion behavior of the electronic components while at the same time substantially determining the thermal expansion behavior of the multilayer printed board.
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| 申请公布号 |
US2003010530(A1) |
申请公布日期 |
2003.01.16 |
| 申请号 |
US20020173625 |
申请日期 |
2002.06.19 |
| 申请人 |
SCHEEL WOLFGANG;KRABE DETLEF;CYGON MANFRED;DIETZ MATHIAS |
发明人 |
SCHEEL WOLFGANG;KRABE DETLEF;CYGON MANFRED;DIETZ MATHIAS |
| 分类号 |
H05K3/46;H05K1/03;(IPC1-7):H05K1/16 |
主分类号 |
H05K3/46 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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