| 摘要 |
A semiconductor device in which a breakage of contacting point by thermal expansion is prevented, an image scanning unit utilizing the same and an image forming apparatus utilizing the same, is disclosed. The semiconductor device includes an assembly 100 in which a semiconductor chip 2 having a functional surface 2a and a power supplying means 5 are electrically connected at the functional surface 2a, and is characterized in the assembly is disposed on a substrate 1 with the power supplying means 5 side being the substrate side, and the substrate 1 and the assembly 100 are fixed together at a portion other than the power supplying means 5 portion.
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