| 摘要 |
<p>A multilayer flexible wiring circuit board on which high-density wiring can be laid and which can be thin and compact and its manufacturing method are disclosed. A double-sided base sheet (24) having a first insulating layer (21) on both sides of which formed are first and second conductive layers (22, 23), a first single-sided base sheet (30) having a second insulating layer (28) on one side of which formed is a third conductive layer (29), and a second single-sided base sheet (33) having a third insulating layer (31) on one side of which formed is a fourth conductive layer (32) are prepared. The first conductive layer (22) is joined to the third conductive layer (29) through a first thermosetting adhesive layer (35), and the second conductive layer (23) is joined to the fourth conductive layer (32) through a second thermosetting adhesive layer (37). Thus, a four-layer flexible wiring circuit board is produced.</p> |
