| 摘要 |
<p>A semiconductor device and semiconductor module having a compact structure and produced at low cost. A semiconductor module (M1) of a first working example comprises semiconductor devices (A1, A2, A3,...) in each of which, external connection electrodes (15, 16) are provided in the peripheral portions of both sides of a printed wiring board (10) and a semiconductor integrated circuit chip (1A) is mounted in the cetral portion. The external connection electrodes (15) of the semiconductor devices (A1, A3) are electrically connected to the external connection electrodes (16) of the semiconductor device (A2) directly or through chip components (30) and relay boards (40) (Fig. 8B) by solder (Sb).</p> |
