发明名称 |
Composite copper foil and manufacturing method thereof |
摘要 |
A composite copper foil (10) comprises a carrier foil (12) formed by electrodeposition onto a cathode, the carrier foil (12) having a cathode side formed in contact with the cathode and an opposite electrolyte side. A very thin release layer (14) is on the electrolyte side of said carrier foil (12). A thin functional foil (16) formed by deposition of copper has a front side in contact with the release layer (14) and an opposite back side. The electrolyte side of the carrier foil (12) has a surface roughness Rz less than or equal to 3.5 mum. There is also presented a method for manufacturing such a composite copper foil.
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申请公布号 |
US2003012975(A1) |
申请公布日期 |
2003.01.16 |
申请号 |
US20020204300 |
申请日期 |
2002.08.19 |
申请人 |
GALES RAYMOND;LANNERS RENE `;STREEL MICHEL;SUZUKI AKITOSHI |
发明人 |
GALES RAYMOND;LANNERS RENE `;STREEL MICHEL;SUZUKI AKITOSHI |
分类号 |
H05K1/09;B32B15/01;C25D1/04;C25D3/38;C25D5/12;C25D7/06;H05K3/02;H05K3/46;(IPC1-7):B32B15/08;B32B15/20 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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