发明名称 Semiconductor device and method for fabricating same
摘要 A semiconductor device includes a semiconductor substrate having a trench in its surface, an insulating film in the trench, a doped conductive layer on the insulating film, a gate insulation film and a gate electrode on the doped conductive layer over the trench, and source and drain impurity regions in the surface of the semiconductor substrate at sides of the gate electrode.
申请公布号 US2003013256(A1) 申请公布日期 2003.01.16
申请号 US20020242765 申请日期 2002.09.13
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., 发明人 CHEONG YEON WOO;BACK YOUNG KUM
分类号 H01L21/334;H01L29/10;(IPC1-7):H01L29/76;H01L21/336;H01L31/062 主分类号 H01L21/334
代理机构 代理人
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