发明名称 Shower head of a wafer treatment apparatus having a gap controller
摘要 A shower head for adjusting distribution of a reactant gas in a process region of a semiconductor manufacturing reaction chamber, wherein a top plate has a gas port for introducing the reactant gas into the reaction chamber; a face plate, having through holes, disposed opposite the process region; a first baffle plate, having through holes, disposed between the top plate and the face plate and capable of moving up or down, wherein the first baffle plate has a top surface that defines a first gap for forming a first lateral flow passage; a second baffle plate, having through holes, disposed between the first baffle plate and the face plate and capable of moving up or down, wherein the second baffle plate has a top surface that defines a second gap for forming a second lateral flow passage; and a gap controller for determining widths of the first and second gaps.
申请公布号 US2003010452(A1) 申请公布日期 2003.01.16
申请号 US20020178757 申请日期 2002.06.25
申请人 PARK JONG-CHUL;KIM DONG-HYUN;KWON O-IK;JO HYE-JIN 发明人 PARK JONG-CHUL;KIM DONG-HYUN;KWON O-IK;JO HYE-JIN
分类号 H01L21/3065;C23C16/44;C23C16/455;H01L21/00;(IPC1-7):C23C16/00;C23F1/00 主分类号 H01L21/3065
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