STACKING LAYERS WITH SUBSTRATES SUPPORTING MICROELECTRONIC DEVICES AND METHOD

摘要

A Neo layer (107, 285) is provided with at least one die (10) having a microelectronic device on an active surface (55) of the die (10). The dies (10) are supported on a support substrate (105, 300) that can be readily handled by machines in an automated manufacturing setting. Both of the die (10) and the substrate (105, 300) are encapsulated in a layer material to provide a distinctive Neo layer or Neo PEM. The different embodiments offer additional respective advantages of improved manufacturability. Further versatility is provided by enabling use of dies (10) from different sources including bare dies (10) and dies (10) that are already packaged in a Plastic Embedded Microcircuit (PEM), for example. The ongoing goal of providing a stackable array of Neo layers (107, 285) is still met.