发明名称 |
Klebstoff und Halbleiterbauelemente |
摘要 |
An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 mu m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive. |
申请公布号 |
DE60000900(D1) |
申请公布日期 |
2003.01.16 |
申请号 |
DE2000600900 |
申请日期 |
2000.06.21 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
YAMAKAWA, KIMIO;ISSHIKI, MINORU;MINE, KATSUTOSHI |
分类号 |
H01L23/12;C08K7/18;C09J11/02;C09J11/04;C09J163/00;C09J183/04;C09J183/07;C09J201/00;H01L21/52;H01L21/56;H01L21/58;H01L21/60 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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