| 发明名称 |
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD |
| 摘要 |
<p>A method for manufacturing a multilayer wiring board comprises a step of alternately stacking prepreg sheets(1)of a resin porous film impregnated with thermosetting resin and double−sided wiring boards(10)having an insulating layer(11)on both sides of which wiring patterns(12)are formed,and heating and compressing the stack into one piece.The multilayer wiring board is advantageous in mass production because the gap for forming the insulating layer is easily controlled.The whole of the wiring board can be thin,and the planarization of the surface of the wiring board is easy.</p> |
| 申请公布号 |
WO03005787(A1) |
申请公布日期 |
2003.01.16 |
| 申请号 |
WO2002JP06537 |
申请日期 |
2002.06.28 |
| 申请人 |
NITTO DENKO CORPORATION;KAWASHIMA, TOSHIYUKI;TAHARA, NOBUHARU;IKEDA, KENICHI |
发明人 |
KAWASHIMA, TOSHIYUKI;TAHARA, NOBUHARU;IKEDA, KENICHI |
| 分类号 |
H05K3/42;H05K3/40;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
