METHOD FOR PRODUCING MULTILAYER WIRING CIRCUIT BOARD
摘要
A method for producing a multilayer wiring circuit board with high reliability by securing a sufficient adhesive strength at the interface between a conductive layer formed on the board and a thermosetting adhesive layer and thereby increasing the adhesive strength between the conductive layers.A thermosetting adhesive layer(15)is formed on a first conductive layer(12).An opening(14)is formed in the thermosetting adhesive layer(15)and filled with a solder powder(17)at a normal temperature.A second conductive layer(23)is formed on the thermosetting adhesive layer(15)and over the opening(14).The solder powder(17)is heated and melted so as to electrically interconnect the first and second conductive layers(12,23).