Mikromechanische Kappenstruktur und entsprechendes Herstellungsverfahren

摘要

The invention relates to a micromechanical cap structure and a corresponding production method. Said structure comprises a first wafer (SW) with a micromechanical functional structure (OMMS)and a second wafer (1) for forming a cap over the micromechanical functional structure (OMMS). The first and second wafer (SW, 1) have a support structure (S, S') with a metal semiconductor contact in their inner region and a connecting structure (BB, BB') in their peripheral region. The peripheral region of the second wafer (1) when capped is convex in relation to the inner region of the second wafer (1).