METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

A method for manufacturing a very−thin printed wiring board a plurality of which can be stacked, characterized by comprising the steps: A. preparing a silicon wafer (20) having a thickness of 50 to 300 µm; B. attaching the silicon wafer (20) to a jig (10) for holding only the edge of the silicon wafer (20), covering the whole surface of the silicon wafer (20) with a film, and fixing the silicon wafer (20) to the jig (10); C. patterning the film to expose the front and back faces of the silicon wafer (20); D. making a through hole in a predetermined position of the exposed silicon wafer (20), and forming a metallic thin film on the exposed surface of the silicon wafer (20) having the through hole; and E. patterning the metallic thin film, and performing etching so as to produce a predetermined conductor pattern.