| 摘要 |
An interposer assembly (10) includes a dielectric plate (12) having a plurality of contact passages (14) extending through the plate with a contac t (20) in each passage. Each contact includes a pair of laterally spaced conta ct points (50) at the top and bottom of the plate. Sandwinching of the interpos er assembly between two substrates (86) brings the contact points on each sprin g arm (42) into engagement with a pad (84), elastically bends the contacts and forms redundant high pressure wiped electrical connections between the conta ct points and pads. |
