| 摘要 |
<p>A conductive contact characterized by being provided with a gold-plated layer (8) placed on a conductive needle element (2) via a Ni substrate layer (7a), formed with a Ni substrate (7b) on the gold-plated layer (8) at a needle portion (2a), and provided with an iridium layer (9) (or titanium nitride layer, or rhodium layer, or hafnium nitride layer) by means of sputtering, whereby it is possible to increase difficulty-of-oxidization and abrasion resistance at the tip end, prolong the durability of the needle element, and reduce running costs without using a special material for the needle element.</p> |
