| 摘要 |
The invention relates to a method of interconnection in three dimensions and to an electronic device obtained by this process. To increase the compactness of integrated circuit modules, the method consists in stacking and adhesively bonding (100) packages containing a chip connected to the output leads via connection conductors inside each package, in cutting (101) through the packages near the chips in order to form a block, the conductors being flush with the faces of the block, and in making (102) the connections on the faces of the block by metalizing (1021) and then etching (1022) the outlines of the connections. The method also applies to the matching of packages in the replacement of obsolete circuits.
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