Production of a printed circuit board comprises positioning a component in the circuit board so that the component partially passes through the board and partially surrounding with part of a shape-memory alloy in its first form, and heating

摘要

Production of a printed circuit board (1) comprises positioning a component (2) in the circuit board so that the component partially passes through the board and partially surrounding the section of the component which passes through the board with part (3) of a shape-memory alloy in its first form; and heating the part so that it is converted into a second form and interlocks with the section of the component. Independent claims are also included for: an assembly element for connecting two electrical components; and an electrical component for placing on the circuit board. Preferred Features: Insertion of the part of the shape-memory alloy is carried out in a heating furnace. A solder paste is applied between the circuit board and the component before commencing the first step of the process. Positioning of the component in the circuit board and heating of the shape-memory alloy are carried out automatically.