Semiconductor package and production method thereof

摘要

A semiconductor package and its production method in which the semiconductor package is produced by having via holes for electrically connecting top and bottom surface of a double-sided copper clad substrate and cutting the substrate at a line separating the via holes into half. The semiconductor package is produced by forming a plurality of wiring patterns on the double-sided copper clad substrate in a matrix fashion, forming via holes for interconnecting the top and bottom sides of the double-sided copper clad substrate at the ends of each semiconductor package wherein the via hole has a long hole shape so that the via hole is shared by adjacent semiconductor packages, attaching semiconductor chips on predetermined positions on the wiring patterns and wiring the chips with terminals, sealing an entire body of the substrate with resin, and cutting the substrate on a line which vertically separates the via hole into half.