METHOD OF ABLATING AN OPENING IN A HARD, NON-METALLIC SUBSTRATE

摘要

A method of ablating a hole into a hard, non-metallic substrate(24) is disclosed. At least on laser assembly (12) capable of generating a laser bea m (16a) in an axis having a focus that is moveable relative to the axis is provided. A focus of the laser beam (16a) is positioned adjacent at least on e surface of the substrate (24). A first layer (Pass-1) of the substrate (24) is ablated by the laser beam (16a). The focus is moved relative to the axis corresponding to the depth of the substrate (24) thereby enabling ablation o f successive layers (Pass 2-10) of the substrate (24) are ablated to generate a hole (32) into the substrate (24).