发明名称 MOLD DEVICE FOR MOLDING
摘要 PROBLEM TO BE SOLVED: To efficiently adjust the temperature of a product cavity long in the mold body opening/closing direction by a temperature adjusting liquid passage. SOLUTION: A movable mold 1 and a fixed mold 2 being mold bodies which are mutually opened/closed and form the product cavity 3 between them when closed and a material passage 11 connected to the cavity 3 through a gate 12 are provided. The temperature adjusting liquid passage 51 surrounding the cavity 3 long in the mold body opening/closing direction is formed spirally. In the temperature adjustment of the cavity 3, by forming the passage 51, a mold can be machined easily, and efficient temperature adjustment is made possible.
申请公布号 JP2003011197(A) 申请公布日期 2003.01.15
申请号 JP20010200072 申请日期 2001.06.29
申请人 MITSUBISHI MATERIALS CORP 发明人 HORIKAWA YOSHIHIRO
分类号 B29C45/73;(IPC1-7):B29C45/73 主分类号 B29C45/73
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