EVALUATION METHOD AND EVALUATION DEVICE OF COMPOUND SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide an evaluation method of compound semiconductor wafer capable of realizing a reduction in processes and an improvement in precision in the quantitative evaluation of areas differed in color on the main face of a compound semiconductor wafer, and an evaluation device used therefor. SOLUTION: The main face W1 of the compound semiconductor wafer W is photographed with a CCD camera 13 in a form capable of discriminating the areas differed in color to acquire image data formed of aggregates of image pixels. The image data are transmitted to a color extraction means 21, and a defective area having a specified color on the main face W1 is discriminated from a non-defective area on the basis of the colors shown by the image pixels. The area of the discriminated defective area or non-defective area is quantified by an image processor 22 on the basis of the number of image pixels showing the color of the area concerned.