| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for preparing an organic polymer film, having high adhesiveness on the interface with other semiconductor material which comes into contact with the lower surface or higher surface of the film when utilized as an interlaminar insulating film constituting a semiconductor device and enabling further reduction of effective permittivity of the whole film. SOLUTION: A plurality of vaporized organic monomers are sprayed through plasma produced in a reaction chamber to a heated substrate surface to form a copolymer film containing a plurality of organic monomers in the skeleton. At this time, an interlaminar insulating film-arranging films rich in siloxane structure excellent in mechanical strength and adhesiveness in the vicinities (91a, (c), 92a, (c) and 93a, (c) of the interfaces and arranging films having low bulk density in sandwiched intermediate layers (91b, 92b and 93b) is continuously grown by changing the relative feed amount of each organic monomer in the film.</p> |
