| 发明名称 |
SEMICONDUCTOR JOINING SUBSTRATE-USE TAPE WITH ADHESIVE AND COPPER-CLAD LAMINATE SHEET USING IT |
| 摘要 |
Semiconductor-use tape with an adhesive comprises a laminate consisting of an insulating film layer having a linear expansion coefficient in a film width direction (TD) at 50-200[deg]C of 17-30 ppm/[deg]C and tensile modulus of elasticity of 6-12 Gpa, and at least one semi-cured adhesive layer. . |
| 申请公布号 |
EP1249863(A8) |
申请公布日期 |
2003.01.15 |
| 申请号 |
EP20010958398 |
申请日期 |
2001.08.22 |
| 申请人 |
TORAY INDUSTRIES, INC. |
发明人 |
OGURA, MIKIHIRO;KIGOSHI, SYOUJI;TOKUNAGA, MASAMI;TSUTSUMI, YASUAKI;KAMEI, RYUICHI;SHIMIZU, KEN |
| 分类号 |
H01L21/60;H01L23/31;H01L23/495 |
主分类号 |
H01L21/60 |
| 代理机构 |
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