发明名称 |
PROCESS FOR FORMING ELECTRICAL/MECHANICAL CONNECTIONS |
摘要 |
<p>A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a tool in order to elongate the mass so as to create a pin, or pin-like, structure having an end to which a further connection may be made.</p> |
申请公布号 |
EP1275143(A2) |
申请公布日期 |
2003.01.15 |
申请号 |
EP20010921615 |
申请日期 |
2001.04.17 |
申请人 |
WAKEFIELD, ELWYN PAUL MICHAEL |
发明人 |
WAKEFIELD, ELWYN PAUL MICHAEL |
分类号 |
H01L21/48;H01L21/60;H05K3/40;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|