发明名称 PROCESS FOR FORMING ELECTRICAL/MECHANICAL CONNECTIONS
摘要 <p>A method of making a connection to a surface of an electronic carrier, the method comprising the steps of: providing a mass of malleable material on the surface of the electronic carrier; connecting the mass to said surface; and extruding the mass into a bore of a tool in order to elongate the mass so as to create a pin, or pin-like, structure having an end to which a further connection may be made.</p>
申请公布号 EP1275143(A2) 申请公布日期 2003.01.15
申请号 EP20010921615 申请日期 2001.04.17
申请人 WAKEFIELD, ELWYN PAUL MICHAEL 发明人 WAKEFIELD, ELWYN PAUL MICHAEL
分类号 H01L21/48;H01L21/60;H05K3/40;(IPC1-7):H01L21/48 主分类号 H01L21/48
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