| 摘要 |
PURPOSE: A method for coating a mirror facet of a semiconductor device is provided to improve the heat characteristic of a laser diode by preventing a mirror coating material from being coated on a metal facet. CONSTITUTION: A semiconductor wafer is provided. Photoresists are coated on upper and lower surface of the semiconductor wafer. The semiconductor wafer is divided into a plurality of bars(11a-11N). A jig(15) is provided for fixing the bars(11a-11N) and first and second spacers(13,14). The bars(11a-11N) and the first and second spacers(13,14) are deposited within the jig(15). A mirror coating material is coated on both mirror facets of the respective bars(11a-11N). The bars(11a-11N) are separated from the jig(15) and the photoresists remaining on both surfaces of the respective bars(11a-11N) are removed.
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