| 摘要 |
1,010,368. Semi-conductor devices. CKD. PRAHA NARODNI PODNIK. June 10, 1963 [June 21, 1962], No. 23101/63. Heading H1K. A hermetically sealed enclosure for a semiconductor device comprises two approximately frusto-conical contact plates 2, 3 having sandwiched therebetween a semi-conductor element 1 and a substantially cylindrical plastics body 4 bonded to the plates and to the element. The plates are covered with a layer of solder so that they may be soldered to the element at the same time as the plastics material is being heat treated. The plastics material should have a coefficient of expansion higher than that of the plates and it should exert a pressure on the plates and element at the normal temperature of the device. Further connecting wires, e.g. 5, to other electrodes of the device may be provided. |
