| 摘要 |
For encapsulating an electronic component, in particular a semiconductor chip the component (3) at a distance is fastened onto a flat substrate (2). For this on the substrate there is deposited an elastomer layer (4, 9) which compensates the differing thermal expansion coefficients between the substrate and the component. A buffer material and/or an adhesive in liquid or pasty form is deposited from a dispenser and the component at room temperature is placed onto the buffer material and/or the adhesive. Before the final curing the buffer material and/or the adhesive is firstly subjected to a precuring. Subsequently the component by way of electrical leads is connected to contact locations on the substrate and lastly there is effected an encasing of all remaining hollow spaces including the electrical leads, with a protective mass. |
