| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for semiconductor device sealing use having excellent characteristics in low stress compatible with stress-sensitive semiconductor elements and in soldering crack resistance at 260 deg.C as the mounting temperature for lead-free solders. SOLUTION: The epoxy resin composition for semiconductor sealing use essentially comprises (A) (A-1) a dicyclopentadiene-modified phenol-type epoxy resin, (A-2) an o-cresol novolak-type epoxy resin and (A-3) a biphenyl-type epoxy resin, (B) a phenol resin, (C) a curing promoter, (D), an inorganic filler and (E) 1-6 wt.% of a stress-diminishing agent, wherein it is characteristic that the compounding weight proportions for the epoxy resins are as follows: (A-1)/[(A-1)+(A-2)+(A-3)]=0.2-0.8, (A-2)/[(A-1)+(A-2)+(A-3)]=0.1-0.4, and (A-3)/[(A-1)+(A-2)+(A-3)]=0.1-0.4. |
