| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder composition dispensing with the cleaning of a residue of flux, hardly causing the deterioration in age of viscosity, printability, soldering property, etc., and containing epoxy-based flux and a lead-free SnZn- based alloy. SOLUTION: In the solder composition containing the lead-free SnZn-based alloy, and the flux for soldering containing at least an epoxy resin and an organic carboxylic and, the organic carboxylic acid is dispersed in a solid state in the solder composition in the room temperature (25 deg.C), or the organic carboxylic and has the molecular weight of 100-200 g/mol, or the organic carboxylic acid or the SnZn-based alloy forms the micro capsule composition covered by a film selected from a group comprising the epoxy resin, a polyimide resin, a polycarbonate resin, a polyamide resin, a polyester resin, a polyuria resin, polyolefine resin, and polysulfone resin.
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